Use Mentor Calibre tool
Command: v2lvs -v counter.v -o counter.sp -i
"Using -i to Generate Simulation Output".
Tuesday, February 15, 2011
Scan insertion using design (DFT) compiler
If the script is optimized gate-level design go with the following:
Constraint-Optimized Scan Insertion Flow under dc_shell
1) select scan style (command: test_default_scan_style style multiplexed_flip_flop)
2) read design description (command: read_verilog)
3) define test protocol (command: set_dft_signal)
4) analyze nonscan design (command: dft_drc)
5) Insert scan cells (command: insert_dft)
Basic Scan Insertion Script
current_design Top
dft_drc
set_dft_configuration -fix_clock enable -fix_set enable \
-fix_reset enable
set_scan_configuration -chain_count
create_test_protocol -infer_clock -infer_async
preview_dft
insert_dft
dft_drc -coverage_estimate
report_scan_path -v exist -chain all
report_constraints -all_violators
If it is unmapped design, i.e., at the RT-level, use test-ready compile.
Constraint-Optimized Scan Insertion Flow under dc_shell
1) select scan style (command: test_default_scan_style style multiplexed_flip_flop)
2) read design description (command: read_verilog)
3) define test protocol (command: set_dft_signal)
4) analyze nonscan design (command: dft_drc)
5) Insert scan cells (command: insert_dft)
Basic Scan Insertion Script
current_design Top
dft_drc
set_dft_configuration -fix_clock enable -fix_set enable \
-fix_reset enable
set_scan_configuration -chain_count
create_test_protocol -infer_clock -infer_async
preview_dft
insert_dft
dft_drc -coverage_estimate
report_scan_path -v exist -chain all
report_constraints -all_violators
If it is unmapped design, i.e., at the RT-level, use test-ready compile.
Wednesday, January 19, 2011
MAC address
Every network interface card (NIC) produced in the world has its own unique MAC address. A MAC address is made up of 6 sets of hexadecimal numbers (two-characters each), e.g. A1:B2:C3:D4:E5:F6
Friday, November 5, 2010
BGA component
BGA stands for Ball Grid Array. A web definition from PrincetonUSA explains it as, "A type of memory chip with solder balls on the underside for mounting. Use of BGA allows die package size to be reduced because there is more surface area for attachment. Smaller packaging allows more components to be mounted on a module, making greater densities available. The smaller package also improves heat dissipation for better performance".
Friday, October 29, 2010
Hspice multiplicity
Given a component with a multiplicity value M , the simulator treats this component as if there were M such components all connected in parallel.
Wednesday, October 13, 2010
Wednesday, August 4, 2010
tar, gzip, zip, bzip2
If want to make a folder into a file, just tar
tar -cvf XXX.tar XXX (create)
tar -xcf XXX.tar (unpack)
if want to compress, then gzip, zip, or bzip2 a tar file
command to expand is gunzip, unzip, and bunzip2
tar -cvf XXX.tar XXX (create)
tar -xcf XXX.tar (unpack)
if want to compress, then gzip, zip, or bzip2 a tar file
command to expand is gunzip, unzip, and bunzip2
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